110/220V power machine for BGA reballing/rework station WDS-650 soldering chip IC machine

Delivery term:The date of payment from buyers deliver within days
  • Price:

    Negotiable

  • minimum:

  • Total supply:

  • Delivery term:

    The date of payment from buyers deliver within days

  • seat:

    Beijing

  • Validity to:

    Long-term effective

  • Last update:

    2017-09-27 20:03

  • Browse the number:

    35

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Shenzhen Wisdomshow Technology Co Ltd
Contactaixin:

Contactaixin:

wisdomshow(Ms.)  

telephone:

Area:

Beijing

Address:

Haosi Western Industrial Park, Xihuan Rd., Bao'an district, Shenzhen, Guangdong, China (518104)

Website:

http://wisdomshow.wangshiguangya.com/

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Model Number: WDS-650 soldering chip IC machine Brand Name: WDS-650 soldering chip IC machine Key Specifications/Special Features: 110/220V power machine for BGA reballing/rework station WDS-650 soldering chip IC machineOur advantages:1. Auto solder and desolder BGA chips, no need to use joystick easy to operate2. High precision optical alignment system rework success rate 99%3. High definition industrial camera + laser position + 15-inch LCD monitor (we can add a side camera to view the chips melting process, just as per your requests) flexible to adjust machine design4. Heating zone (IR area) is good for laptop, mobile phone, PS3 Xbox 360, PCB board, doesn't damaged board wide application
WDS-650 soldering chip IC machine:
1. Upper heating head and placement head are design 2-in-1, which have automatic welding and automatic placement function
2. WDS-650 uses the touchscreen, HMI, PLC control, which can show you the three temperature curves anytime and the temperature control can accurate to +1°C, soldering chip IC machine
8 paragraph temperature controls, which can be set to warm up, insulation, heating, soldering 1, soldering 2, coolingexcellent temperature control system can ensure best soldering effect
3. Have 3 temperature zones to heating independent, first and second temperature zones can control many groups and paragraphs temperatures at same time, third temperature zone can preheating a large areas of PCB board and make the best soldering effect
4. Second zone designs specially to supports PCB board, which can go up and down, prevent PCB board collapse from the damage during soldering
5. Select high precision K-type thermocouple closed-loop control, temperature measurement interface in outside can achieve precise temperature detection soldering chip IC machine
6. Store more than 100 temperature cure setting, change setting and analysis the curve at anytime
7. Using V-shaped groove to position PCB board, removable universal jigs can protect the PCB board
8. Using high power cross-flow fan to cooling PCB board in a short time, protect PCB board and ensure soldering effect
9. With alarm function, after BGA welding machine can alarm by itself
In the case of temperature abuse, circuit can power off automatically with the double over-temperature protection
10. Touchscreen control of upper heating system and optical digital device, easy to operate and ensure alignment precision control within 0.01-0.02mm soldering chip IC machine
11. Using high precision optical alignment video system with spectral amplification, fine-tuning function, with 15" color LCD monitor
High automatic, can avoid the human operating errors and have excellent special effect on lead-free technology as well as the pop packing devices

*Training and warranty:
Lifetime free training of operation and maintenance
Warranty: lifetime free service, one year warranty
Total power 5300Wsoldering chip IC machine
Upper heating power 1200W
Lower heating power Second temperature zone 1200W, third temperature zone 2700W
Power supply (Single phase) 110/220V AC ±10 50Hz ±3/5.2kVA
Overall dimensions (L) 880 x (W) 880 x (H) 720mm (not includes display holder)
Locating way V-shaped groove, PCB holder can adjust any direction of X, Y
Temperature controlling (high precision K-sensor)(closed loop), UP and down can test temperature independently
Large PCB size 450 x 430mm
Small PCB size 10 x 10mm
Chip zoom multiple 2-50multiple
Weight of machine 85 kg
Advantages optical alignment system + CCD camera all around + HD monitor + laser positioning + large IR heating zone, good for any motherboard and BGA chips repair and rework, like Xbox 360, TV motherboard, industrial motherboard
Shipping Information:
  • FOB Port: China (Mainland)
  • Lead Time: 2 - 3 days
  • HTS Code: 8515.80.90 90
  • Dimensions per Unit: 81 × 68 × 90 Centimeters
  • Weight per Unit: 100 Kilograms
  • Units per Export Carton: 1
  • Export Carton Dimensions L/W/H: 81 × 68 × 90 Centimeters
  • Export Carton Weight: 100 Kilograms
Main Export Markets:
  • Asia
  • Australasia
  • Central/South America
  • Eastern Europe
  • Mid East/Africa
  • North America
  • Western Europe

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